Die Inspection

At MEM Hitech, individual dies on each wafer are inspected for the following defects:

  • Scratches
  • Metal Voids
  • Probe Damages
  • Metal Bridging
  • Passivation Defects
  • Scribe Defects
  • Foreign Materials
  • Stained Pads
  • Other defect criteria as specified by customers

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    Die inspection is performed in a Class 1000 Clean Room by highly trained operators following the strictest QA procedures.

     

     

    The inspection workstations are state-of-the-art equipment and are installed on vibration-isolation tables to prevent magnification of miniscule vibrations due to truck traffic.

     

    Although operators are intensively trained to achieve a speed of 2.5 dies per second with 98.5% accuracy, but speed is not a determination factor whereas accuracy is of paramount importance. With the Class 1000 clean room and currently twenty inspection workstations, this factory has a capcity to inspect 20 – 30 million dies  per month with a single shift of operation.