Mem Hitech is capable of providing a full spectrum of semiconductor packaging services ranging from Dicing (Wafer Saw), Die Inspection, Die Attach, Wire Bonding and other related processes, depending on customer requirements.
Wafer dicing is the process by which die are separated from a wafer of semiconductor following the processing of the wafer. The dicing process can be accomplished by scribing and breaking, by mechanical sawing (normally with a machine called a dicing saw) or by laser cutting. Following the dicing process the individual silicon chips are encapsulated into chip carriers which are then suitable for use in building electronic devices such as computers, etc.
At MEM Hitech, individual dies on each wafer are inspected for the following defects:
• Metal Voids
• Metal Bridging
• Passivation Defects
• Probe Damage
• Scribe Defects
• Stained Pads
• Foreign Materials
Die Attach (also known as Die Mount or Die Bond) is the process of attaching the silicon chip to the die pad or die cavity of the support structure (e.g., the leadframe) of the semiconductor package. There are two common die attach processes, i.e., adhesive die attach and eutectic die attach. For high-powered applications, the die is usually eutectic bonded onto the package for good heat conduction. For low-cost, low-powered applications, the die is often glued directly onto a substrate using an epoxy adhesive.
There are basically two forms of wire bonds, Wedge bonds and Ball bonds. Recent industry survey shows that about 90% of all electronic packages and assemblies are produced using ball bonds and about 10% are produced with wedge bonds. An increase in the use of ball bonding is expected as semiconductor devices increase in functionality and decrease in size causing smaller bond pads and closer bond pad spacing.