Wafer dicing is the process by which die are separated from a wafer of semiconductor following the processing of the wafer. The dicing process can be accomplished by scribing and breaking, by mechanical sawing (normally with a machine called a dicing saw) or by laser cutting. Following the dicing process the individual silicon chips are encapsulated into chip carriers which are then suitable for use in building electronic devices such as computers, etc.
During dicing, wafers are typically mounted on dicing tape which has a sticky backing that holds the wafer on a thin sheet metal frame. Once a wafer has been diced, the pieces left on the dicing tape are referred to as die, dice or dies. These will be packaged in a suitable package or placed directly on a printed circuit board substrate as a "bare die". The areas that ha ve been cut away are called die streets which are typically about 75 micrometres (0.003 inch) wide. Once a wafer has been diced, the die will stay on the dicing tape until they are extracted by die handling equipment, such as a die bonder or die sorter, further in the electronics assembly process.
The size of the die left on the tape may range from 35 mm (very large) to 0.5 mm square (very small). The die created may be any shape generated by straight lines, but they are typically rectangular or square shaped.
PRECISION DICING SAW
Dicing Department equipped with DISCO saw machines model DFD651, D.I Water System , Microscope Machines….
- DFD651 is parallel dual-spindle dicers used for such dual-spindle applications as step cuts and dual cutting. This saw machine can be operated automatically, with high accuracy.
Figure 1. DISCO Saw Machine, DFD651
DFD651 perform loading, alignment, cutting, cleaning and drying, and unloading with just the touch of a button . This DFD handles silicon , glass and variety cutting and dicing tasks.
- D.I Water System
Figure 2. D.I Water Systems
Why use D.I Water System?
The deionization process removes ions (cations and anions), dissolved solids and gases, including: • Sodium, calcium, and magnesium (cations)
• Sulfates, alkalinity, chlorides, carbon dioxide, and silica (anions)
Deionization is accomplished by passing water through ion exchange columns containing cation and anion resins. The result is water without ions minerals and salts.